PLC Wafer & Chip

PLC Wafer

  • PLC Wafer

Profile:

Based on the Planar Lightwave Circuit (PLC) technology, Optical Splitter Wafer is made by methods of coating, lithography and ex-change on glass substrate into different channels, which include 2-channel, 4-channel, 8-channel, 16-channel,32-channel and 64-channel. Then, Optical Splitter Wafer would be made into high optical performance, high yield, high stability and reliability PLC Splitter Chip through processes of cover-sticking, cutting, grinding and polishing.

Inquiry

Application:

• FTTX Network System
• Analog & Digital Optical Network
• CATV Network System
• Optical Module and System

 

Feature

• Low Insertion Loss and PDL
• Excellent Uniformity
• Excellent vibration & drop resistance
• Wide range of operating wavelength
• High reliability compliance to Telcordia-1209 & 1221 and PCT extreme environmental test

 

Technical Index and Dimension

Diameter
Thickness
Working wavelength
Thermal properties
4inch
(101.6±1.0mm)
2.5±0.2mm
1260nm~1650nm
Applicable to temperature≤150℃

 

 

 
1x2
1x4
1x8
1x16
1x32
1x64
Output distance (um)
250
250
127
127
127
127
Chip dimension (mm)
9.45X2.05
11.05X2.05
13.65X2.05
17.35X2.55
20.65X4.75
27.85X8.65
Chip particle quantity (pcs)
>265
>250
>195
>115
>47
>14
Technical index
IL
3.6
6.8
9.8
13.2
16.3
19.6
PDL
0.15
0.15
0.15
0.15
0.15
0.2
Uni.
0.5
0.6
0.7
0.9
1.2
1.4
Qualified rate
>95%
>95%
>93%
>90%
>87%
>85%

 

Add: No.1 Xindi Road, Gangtou community,
Bantian Street, Longgang District,
Shenzhen City, China
Tel: +86 755 2880 1823
E-mail: sales@sindi.com.cn

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