PLC Wafer & Chip

PLC Chip

  • PLC Chip

Profile:

PLC Splitter Chip is based on lithography technology to divide the optical power from one or two input port(s) into multiple output ports by Planar Lightwave Circuit technology. As one of the key components of PLC Splitter, SINDi's Chip has high photonics, stability and reliability.

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Technical Index and Structure 

 

Technical index
1x2
1x4
1x8
1x16
1x32
1x64
Operation wavelength(nm)
1260~1650
Output port pitch (um)
250
250
127
127
127
127
Chip dimension L*W*H
±0.01 (mm)
8.8*1.8*2.5
10.4*1.8*2.5
13*1.8*2.5
16.7*2.3*2.5
20*4.5*2.5
27.2*8.4*2.5
Chip particle quantity (pcs)
>265
>250
>195
>115
>47
>14
IL (dB) Max.
3.6
6.8
9.8
13.2
16.3
19.6
PDL (dB) Max.
0.15
0.15
0.15
0.15
0.15
0.2
Uni. (dB) Max.
0.5
0.6
0.7
0.9
1.2
1.4
Polishing angle(θ)
8°±0.3°
Return Loss (dB)
≥55
Maximum power injection
50mW
Directivity (dB)
55
Qualified rate
>95%
>95%
>93%
>90%
>87%
>85%

 

Add: No.1 Xindi Road, Gangtou community,
Bantian Street, Longgang District,
Shenzhen City, China
Tel: +86 755 2880 1823
E-mail: sales@sindi.com.cn

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