Cologne, Germany – May 2026 – SINDI is showcasing the company's latest innovations in network connectivity at the ANGA COM exhibition.

At this leading European broadband event, SINDI is presenting its newly designed pre-connected products, emphasizing efficiency and ease of installation for applications. We are also exhibiting our consistently high-quality portfolio, including data center cabinets, MTP/MPO solutions, and sub boxes (distribution boxes) etc, all of which continue to attract significant interest from industry professionals.

Throughout the exhibition, the SINDI team is engaging with partners and customers from across Europe, reinforcing the company's commitment to reliable performance and precision engineering.

SINDI is dedicated to continuously supporting evolving network infrastructures through its product upgrading.

The ANGA COM exhibition is in full swing, and SINDI sincerely invites you to visit our booth to explore our products.

Where: Koelnmesse, Cologne – Hall 8, Stand F71

We look forward to meet you.