TSMC, the world's largest chip foundry, announced record results for the second quarter of 2025, with consolidated revenue

 of NT$933.79 billion (about US$30.07 billion) as of June 30, up 38.6% in NT dollars from the same period last year, and up 

44.4% in US dollars. Quarterly net profit soared to NT$398.27 billion, with earnings per share of NT$15.36, a year-on-year 

surge of 60.7%.

The company's CFO Huang Renzhao said: "The performance growth is mainly driven by strong demand for cutting-edge

process technology." Data shows that the 3nm process contributes 24% of total wafer revenue, 5nm accounts for 36%, 

7nm accounts for 14%, and advanced processes (7nm and below) account for a total of 74%. It is worth noting that 

high-performance computing business, including AI chips, now accounts for three-fifths of total revenue, marking the 

company's successful strategic transformation from dependence on the smartphone market.

Based on the continued hot demand for AI, TSMC raised its full-year revenue growth forecast in US dollars for 2025 from

 "mid-20%" to "about 30%." The third-quarter revenue guidance is set at between $31.8 billion and $33 billion, with a gross

 margin of 55.5%-57.5%. Billy Leung, investment strategist at Global X ETFs, pointed out: "This financial report once again 

dispels concerns about slowing AI growth, and the demand outlook remains strong."

To meet the AI chip needs of American customers, TSMC is accelerating its expansion plan in Arizona. CEO Wei Zhejia 

revealed that the production time of some factories will be advanced by "several quarters" to create a "super wafer fab 

cluster." The company pledged in March to add $100 billion in US investment, bringing the total investment to $165 billion, 

covering 6 wafer fabs, 2 advanced packaging plants and 1 R&D center. The first Arizona factory has achieved a yield rate 

comparable to that of Taiwan.

In terms of global layout, TSMC plans to build a second factory in Japan this year and continue to expand its investment 

in Germany and Taiwan. According to Counterpoint Research data, the global "foundry 2.0" market (including packaging 

and testing) will generate revenue of US$72.29 billion in the first quarter of 2025, with TSMC leading the market with a 

35% market share. Analyst Brady Wang pointed out: "Intel has made progress in its 18A process, while Samsung is facing 

challenges in the yield rate of 3nm GAA."